https://wiki.tradeville.ro/index.php?action=history&feed=atom&title=Amkor_Technology%2C_Inc. 2026-04-18T16:56:17Z Istoricul versiunilor pentru această pagină din wiki MediaWiki 1.39.2 https://wiki.tradeville.ro/index.php?title=Amkor_Technology,_Inc.&diff=446819&oldid=prev 2024-09-29T03:43:45Z

<p>The LinkTitles extension automatically added links to existing pages (https://github.com/bovender/LinkTitles).</p> <table style="background-color: #fff; color: #202122;" data-mw="interface"> <col class="diff-marker" /> <col class="diff-content" /> <col class="diff-marker" /> <col class="diff-content" /> <tr class="diff-title" lang="ro"> <td colspan="2" style="background-color: #fff; color: #202122; text-align: center;">← Versiunea anterioară</td> <td colspan="2" style="background-color: #fff; color: #202122; text-align: center;">Versiunea de la data 29 septembrie 2024 06:43</td> </tr><tr><td colspan="2" class="diff-lineno" id="mw-diff-left-l2">Linia 2:</td> <td colspan="2" class="diff-lineno">Linia 2:</td></tr> <tr><td class="diff-marker"></td><td style="background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;"><br/></td><td class="diff-marker"></td><td style="background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;"><br/></td></tr> <tr><td class="diff-marker"></td><td style="background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;"><div>==Descriere companie==</div></td><td class="diff-marker"></td><td style="background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;"><div>==Descriere companie==</div></td></tr> <tr><td class="diff-marker" data-marker="−"></td><td style="color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #ffe49c; vertical-align: top; white-space: pre-wrap;"><div>Amkor Technology, Inc. (www.amkor.com) is a providers of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The semiconductor manufacturing process consists of Integrated circuit (IC) design, wafer fabrication, wafer probe, packaging and final test. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. IDMs generally design, manufacture, package and test semiconductors in their own facilities.</div></td><td class="diff-marker" data-marker="+"></td><td style="color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;"><div>Amkor Technology, Inc. (www.amkor.com) is a providers of outsourced semiconductor packaging and <ins style="font-weight: bold; text-decoration: none;">[[</ins>test<ins style="font-weight: bold; text-decoration: none;">]] </ins>services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The semiconductor manufacturing process consists of Integrated circuit (IC) design, wafer fabrication, wafer probe, packaging and final test. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. IDMs generally design, manufacture, package and test semiconductors in their own facilities.</div></td></tr> <tr><td class="diff-marker"></td><td style="background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;"><br/></td><td class="diff-marker"></td><td style="background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;"><br/></td></tr> <tr><td class="diff-marker"></td><td style="background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;"><div>==Grafic actiuni companie==</div></td><td class="diff-marker"></td><td style="background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;"><div>==Grafic actiuni companie==</div></td></tr> <!-- diff cache key tradeville_wiki:diff::1.12:old-406161:rev-446819 --> </table>

127.0.0.1 https://wiki.tradeville.ro/index.php?title=Amkor_Technology,_Inc.&diff=406161&oldid=prev 2024-09-18T13:37:21Z

<p>Pagină nouă: Pagina dedicata companiei Amkor Technology, Inc. listata cu simbolul US.AMKR ==Descriere companie== Amkor Technology, Inc. (www.amkor.com) is a providers of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical and thermal performance. It provides turnkey packaging and...</p> <p><b>Pagină nouă</b></p><div>Pagina dedicata companiei Amkor Technology, Inc. listata cu simbolul US.AMKR<br /> <br /> ==Descriere companie==<br /> Amkor Technology, Inc. (www.amkor.com) is a providers of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The semiconductor manufacturing process consists of Integrated circuit (IC) design, wafer fabrication, wafer probe, packaging and final test. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. IDMs generally design, manufacture, package and test semiconductors in their own facilities.<br /> <br /> ==Grafic actiuni companie==<br /> &lt;iframe key=&quot;tradeville&quot; path=&quot;graficSimbol/US.AMKR&quot; /&gt;<br /> <br /> ==Ultimele stiri despre Amkor Technology, Inc. (US.AMKR)==<br /> &lt;dynamicpagelist&gt;<br /> category=US.AMKR<br /> count=10<br /> order=descending<br /> addfirstcategorydate=false<br /> &lt;/dynamicpagelist&gt;<br /> <br /> [[Categorie:US.AMKR]][[Categorie:Stiri despre companii]]</div>

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