Kulicke and Soffa Industries, Inc.: Diferență între versiuni

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(Pagină nouă: Pagina dedicata companiei Kulicke and Soffa Industries, Inc. listata cu simbolul US.KLIC ==Descriere companie== Kulicke and Soffa Industries, Inc. (www.kns.com) designs, manufactures and sells capital equipment and tools used to assemble semiconductor devices, including integrated circuits (ICs), high and low powered discrete devices, light-emitting diodes (LEDs), and power modules. The Company operates through two segments: Capital Equipment and Aftermarket Products and Ser...)
 
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==Descriere companie==
==Descriere companie==
Kulicke and Soffa Industries, Inc. (www.kns.com) designs, manufactures and sells capital equipment and tools used to assemble semiconductor devices, including integrated circuits (ICs), high and low powered discrete devices, light-emitting diodes (LEDs), and power modules. The Company operates through two segments: Capital Equipment and Aftermarket Products and Services (APS). The Capital Equipment segment engages in the manufacture and sale of ball bonders, wafer level bonders, wedge bonders, packaging and electronic assembly solutions to semiconductor device manufacturers, integrated device manufacturers (IDMs), outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers. The APS segment engages in the manufacture and sale of tools for a range of semiconductor packaging applications, spare parts, equipment repair, maintenance and servicing, training services, refurbishment and upgrades for its equipment.
Kulicke and Soffa Industries, Inc. (www.kns.com) designs, manufactures and sells capital equipment and tools used to assemble semiconductor devices, including integrated circuits (ICs), high and low powered discrete devices, light-emitting diodes (LEDs), and power modules. The Company operates through two segments: Capital Equipment and Aftermarket Products and Services (APS). The Capital Equipment segment engages in the manufacture and sale of ball bonders, wafer level bonders, wedge bonders, packaging and electronic assembly solutions to semiconductor device manufacturers, integrated device manufacturers (IDMs), outsourced semiconductor assembly and [[test]] providers (OSATs), other electronics manufacturers and automotive electronics suppliers. The APS segment engages in the manufacture and sale of tools for a range of semiconductor packaging applications, spare parts, equipment repair, maintenance and servicing, training services, refurbishment and upgrades for its equipment.


==Grafic actiuni companie==
==Grafic actiuni companie==
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